Aeluma's Breakthroughs in Heterogeneous Integration Featured in Compound Semiconductor Magazine
Article Highlights Aeluma’s Shortwave Infrared Sensor Products for Consumer Markets
Aeluma has been featured in an article published by Compound Semiconductor magazine. Titled “Realizing high-performance sensors with heterogeneous integration,” the piece highlights our innovative advancements in shortwave infrared (SWIR) photodetector technology.
At Aeluma, we’ve developed a groundbreaking approach to manufacturing SWIR photodetectors by integrating high-performance materials with large-diameter silicon substrates. This unique method bridges the gap between cutting-edge SWIR technology and scalable, cost-effective production processes typically reserved for mass-market microelectronics. The result? Affordable, high-performance sensors designed for both consumer and industrial applications, setting the stage for next-generation advancements in sensing and communication technologies.
This technical feature in Compound Semiconductor highlights the transformative potential of Aeluma’s technology. Large-diameter wafer manufacturing may unlock new possibilities for AI, 5G, AR/VR, and beyond.
The article, authored by Aeluma’s CEO Jonathan Klamkin, Ph.D., and Principal Scientist, Bei Shi, Ph.D., explains that the company’s proprietary heterogeneous integration technology combines high-performance indium gallium arsenide (InGaAs) materials with silicon. This innovation addresses critical market needs for sensor applications in autonomous systems, aerospace, AI, and AR/VR by delivering high-sensitivity, energy-efficient photodetectors at an unprecedented scale.
Click here to read the full article featured in Compound Semiconductor magazine.